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Wafer Fab Beol Feol 12-Inch Automatic Precision Dicing Machine Wafer Automatic Operation From Loading, Aligning, Cutting, Cleaning to Unloading
US$47,000.00-63,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearTransport Package
Wooden CrateSpecification
1200mm*1550mm*1800mmTrademark
minder-hightechOrigin
GuangzhouHS Code
8015809090Production Capacity
200PCS/Yearpcs/YearKey features
Fully Automatic Operation: Automates loading, aligning, cutting, cleaning, and unloading of 12-inch wafers.
High-Power Dual Spindles: Equipped with opposed dual-spindles for efficient high-speed cutting.
Precision Alignment System: NCS and special microscopes reduce alignment time and labor costs.
Integrated Cleaning Function: Combines cutting and two-fluid cleaning with wafer drying in one workflow.
High Precision Accuracy: Single positioning accuracy <=0.002mm with repeatability of 0.001mm.
Customizable Groove Depth: Groove depth adjustable up to 4mm or customized to specific requirements.
Optional Detection Functions: Supports optional tool mark, blade breakage, and workpiece shape detection.
Wide Material Compatibility: Cuts silicon wafers, ceramics, glass, quartz, PCB boards, and more.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤9.21h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period for this machine?
A:
The machine comes with a 1-year warranty and 1-year after-sales service.
Q:Can the groove depth be customized?
A:
Yes, the groove depth is up to 4mm or can be customized according to requirements.
Q:What types of materials can be cut by this machine?
A:
It is suitable for silicon wafers, lithium niobate, ceramics, glass, quartz, alumina, and PCB boards.
Q:What is the spindle rotation speed range?
A:
The spindle rotation range is 6000 to 60000 rpm.
Q:What are the lead times for production?
A:
The lead time is one month for both peak season and off-season.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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