Modular architecture, maximum flexibility: Modular assembly, quick head change (tool-free), single-sided operation + flexible line layout.
High-speed placement, leading capacity: Dual-track parallel processing: Simultaneously processes two PCBs, increasing capacity per unit area by 50%, suitable for high-density consumer electronics.
Ultra-high precision, full component coverage, accurate positioning, low-impact placement (0.5N), zero damage.
Intelligent feeding, error prevention + high efficiency, RFID intelligent feeder, large-capacity feeding, pallet/reel compatibility.
AI vision + end-to-end quality control, 3D vision + deep learning, automatic rejection of defective products, PCB warpage compensation, full-process traceability.
Smart factory adaptation, cost reduction and efficiency improvement, offline maintenance, low-energy design.