Low Void Vacuum Vapor Phase Soldering Oven Uniform Heat Distribution Miniature Chip PCB Welding Machine

Maximum heating temperature is fixed by boiling point of thermal fluid; components will never overheat, eliminating thermal damage to sensitive chips, LEDs and thin substrates.

Constant & Uniform Heat Transfer (Core Advantage)

Smooth, dense solder bumps for BGA, QFN, microchip and fine-pitch components, greatly improving product stability and yield.

Zero oxidation on pads, pins and solder paste; no discoloration or poor wetting issues.

Significantly reduces warpage, delamination and component cracking caused by rapid hot-air convection heating.

Works for heavy power boards, high thermal mass assemblies, stacked components and mixed-size PCBs simultaneously.

Sealed heating chamber with full Galden/PFPE liquid recovery circulation. Low fluid consumption, long service life and low running cost.