SMT Reflow Oven Thermal Profiler Kic X5 for PCB Soldering Process Optimization

Enhanced Double Rail Structure: Improves production efficiency, saves energy, and prevents board sticking or falling.

High Heat Transfer Efficiency: 8MM thickened aluminum alloy plates offer 15% improvement for lead-free processes.

Energy Saving Design: Multi-layer insulation reduces shell temperature by 10-20 degrees and recycles exhaust gas.

Precise Temperature Control: Micro-circulation technology ensures uniform temperature and high accuracy for PCB welding.

Fast Heating Capability: Reaches constant temperature from room temperature in less than 20 minutes.

Automatic Width Adjustment: Closed-loop PID control with 0.2mm accuracy ensures guide rail parallelism.

Comprehensive Safety Protection: Includes UPS power-off protection to ensure normal PCB output during outages.

Customized Service Available: OEM and ODM services are available for SMT line requirements.