Comprehensive Service Suite: Offers reverse engineering, PCB fabrication, PCBA assembly, stencil fabrication, and component sourcing.
Flexible Customization Options: Supports full, minor, and flexible customization from samples or designs with various material and layer options.
Low MOQ for Samples: Minimum Order Quantity is 1 piece, supporting transition from sample to mass production.
Fast Sample Delivery: Sample delivery time is within 3 days for urgent needs.
High DIP Capacity: Production capacity reaches 100 thousand pins per day for DIP assembly.
Wide Layer and Size Range: Supports 1-48 layers with board sizes from 5x5mm up to 900x600mm.
Diverse Surface Finishing: Available finishes include Lf Hal, OSP, Enig, Enepig, and Immersion Silver.
Strict Quality Assurance: Products meet IPC-II standards with AOI, X-ray, and function testing for PCBA.