Comprehensive Service Suite: Reverse engineering, PCB fabrication, PCBA assembly, stencil fabrication, and component sourcing.
Flexible Customization: Full customization from samples or designs with flexible options for materials and layers.
Low MOQ for Samples: Minimum Order Quantity is 1 piece, supporting transition from sample to mass production.
Fast Sample Delivery: Sample delivery completed within 3 days for urgent prototyping needs.
Wide Material Options: FR-4 base material with Tg135 to Tg250 options for various thermal requirements.
Multi-Layer Capability: Production capacity for 1 to 48 layers with board thickness ranging from 0.2 to 6.0 mm.
Diverse Surface Finishes: Options include Lf Hal, OSP, Enig, Enepig, and Immersion Silver for different applications.
Strict Quality Standards: Products meet IPC-II standards with AOI, X-ray, and function testing for all boards.