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Product profile
Customization
AvailableType
Rigid Circuit BoardDielectric
FR-4Model NO.
AD7656BSTZ-1 (ADI)Material
Fiberglass Epoxy Resin + Polyimide ResinApplication
Consumer ElectronicsFlame Retardant Properties
V2Mechanical Rigid
RigidProcessing Technology
Electrolytic FoilBase Material
CopperInsulation Materials
Epoxy ResinBrand
New ChipCapacity
1000000OEM/ODM
AvailableSample
AvailableSurface Treatment
OSP, Enig, HASL, AG ImmersionCertificate Gurantee
YesTest
100%E-TestingMin Bonding Pad Diameter
10milMin Thickness of Soldermask
10umColor of Silk-Screen
White, Yellow, BlackData File Format
Gerber File and Drilling File, Protel Series, ...Material for PCB
Fr-4, High Tg Fr$, Halogen Free,Layer Count
1-20 LayersShipping
DHL/UPS/FedEx/Air/SeaTransport Package
Foam PackingSpecification
FR4 1-4 LayersTrademark
New ChipOrigin
ChinaHS Code
8534009000Production Capacity
1000000Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 4 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.08h
AI-Powered supplier vetting
SummaryThe supplier is a combined company engaged in electronic products, components, communication equipment, computer hardware and software, and integrated-circuit-related activities. It reports broad customization services, ODM availability, and new products within the past year, indicating active R&D and product development. Production-related information includes a factory location, more than 10 production lines, and 6–10 quality-control staff, but there is no valid manufacturing-capacity contract with related subcontractors. The supplier has in-stock capability, accepts multiple quotation and payment terms, and reports one-month lead times in both peak and off-season periods. Overseas support is limited: it has no overseas warehouse, showroom, agent, branch, or stated overseas-service countries. No certifications or customer cases are identified, and the available financial information is insufficient for assessment.
Supplier typeThe supplier is identified as a combined company with a registered and physical office in Shenzhen, while its factory is separately located in Baoan District, Shenzhen. Its stated business scope covers electronic products, electronic components, communication equipment, computer hardware and software, and integrated-circuit-related sales and technical services.
R&D capabilityThe supplier reports that it had new products in the past year, provides ODM services, and supports multiple customization modes. However, it reports no available SDK and only one year of total R&D-engineer experience, so the evidence supports product-development activity but not a uniformly strong innovation profile.
Production capacityThe supplier reports more than 10 production lines, 6–10 quality-control staff, in-stock capability, and one-month average lead times in both peak and off-season. However, it also states that no valid manufacturing-capacity contract exists with related subcontractors, and the assessment procedures have written procedures but no records, creating a documented operational limitation.
Customization capabilityThe supplier explicitly supports customization from samples, customization from designs, full customization, minor customization, and flexible customization. It also reports ODM availability and new products during the past year, directly supporting broad customization capability.
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Shenzhen New Chip international Ltd
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