Electronics Mobile Phone PCB Assembly Board Android PCBA Multilayer PCB Circuit Boards PCBA Manufacturer

Name: Electronics Mobile Phone PCB Assembly Board Android PCBA Multilayer PCB Circuit Boards PCBA Manufacturer
Brand: Shenzhen New Chip international Ltd
SKU: 2002934465

Guangdong, ChinaShenzhen New Chip international Ltd

US$0.10-10.00

1 Piece

Sample price:US$10.00/piece.Request sample

Product profile

Customization

Available

Metal Coating

Copper

Mode of Production

SMT

Model NO.

NEW-CHIP-CP0034

Layers

Multilayer

Base Material

FR-4

Certification

RoHS, CCC, ISO

Customized

Condition

New

Board Thickness

0.21--7mm

Min. Hole Size

0.10mm

Min. Line Width

3mil

Min. Line Spacing

3mil

Surface Finishing

HASL

Soldermask

Green,Yellow,Black,White,Red

Silkscreen

White,Yellow,Black

Special Technological Requirement

Blind & Buried Vias and High Thickness Copper

Needed

Gerber File,Bom List,Sample If Better

Board Copy Service

Yes

PCB Factory

Yes

Transport Package

Bubble Anti-Static Bag. for Al, Composite Anti-Sta

Specification

Copper Thickness: H oz to 6oz

Trademark

New Chip

Origin

Guangdong, China

Production Capacity

30000 Square Meter/Square Meters Per Month

Company profile

Importers and ExportersExhibition ExperienceFast DeliveryStandardized quality control

Shenzhen New Chip international Ltd

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 4 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.43h

AI-Powered supplier vetting

SummaryThe supplier is a combined company engaged in electronic products, components, communication equipment, computer hardware and software, and integrated-circuit-related activities. It reports broad customization services, ODM availability, and new products within the past year, indicating active R&D and product development. Production-related information includes a factory location, more than 10 production lines, and 6–10 quality-control staff, but there is no valid manufacturing-capacity contract with related subcontractors. The supplier has in-stock capability, accepts multiple quotation and payment terms, and reports one-month lead times in both peak and off-season periods. Overseas support is limited: it has no overseas warehouse, showroom, agent, branch, or stated overseas-service countries. No certifications or customer cases are identified, and the available financial information is insufficient for assessment.

Supplier typeThe supplier is identified as a combined company with a registered and physical office in Shenzhen, while its factory is separately located in Baoan District, Shenzhen. Its stated business scope covers electronic products, electronic components, communication equipment, computer hardware and software, and integrated-circuit-related sales and technical services.

R&D capabilityThe supplier reports that it had new products in the past year, provides ODM services, and supports multiple customization modes. However, it reports no available SDK and only one year of total R&D-engineer experience, so the evidence supports product-development activity but not a uniformly strong innovation profile.

Production capacityThe supplier reports more than 10 production lines, 6–10 quality-control staff, in-stock capability, and one-month average lead times in both peak and off-season. However, it also states that no valid manufacturing-capacity contract exists with related subcontractors, and the assessment procedures have written procedures but no records, creating a documented operational limitation.

Customization capabilityThe supplier explicitly supports customization from samples, customization from designs, full customization, minor customization, and flexible customization. It also reports ODM availability and new products during the past year, directly supporting broad customization capability.