How do you ensure product quality?

We perform 100% inspection on finished products, including visual and functional tests, using flying probe and other advanced testing equipment.

What are the available surface finish options?

Options include HASL (Lead Free), ENIG, OSP, Immersion Silver, Immersion Tin, Immersion Nickel, and Hard Gold.

What is the maximum number of layers supported?

We can manufacture rigid circuit boards with up to 32 layers.

Turnkey PCB and PCBA Manufacturer PCB Assembly Board Bom Gerber Files Service

Name: Turnkey PCB and PCBA Manufacturer PCB Assembly Board Bom Gerber Files Service
Brand: Shenzhen New Chip international Ltd
SKU: 1936796061

Guangdong, ChinaShenzhen New Chip international Ltd

US$0.60-4.23

1 Piece

Sample price:US$1.00/piece.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

FR-4

Material

Fiberglass Epoxy

Application

Communication

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Electrolytic Foil

Base Material

Copper

Insulation Materials

Epoxy Resin

Brand

New Chip

Layer

1-32 Layers

Service

OEM/ODM

Available

Test

100%E-Testing

Layer Count

1-20 Layers

Shipping

DHL/UPS/FedEx/Air/Sea

Surface Treatmen

OSP, Enig, HASL, AG Immersion

Certificate Gurantee

Yes

Transport Package

Vacuum Packaging, Carton Box

Specification

FR-4 SILICON COMPONENTS

Trademark

New Chip

Origin

China

HS Code

8534009000

Production Capacity

30000 Square Meter/Square Meters Per Month

Key features

OEM/ODM Customization: Supports full customization from samples, designs, and flexible minor adjustments.

100% Quality Testing: Includes flying probe, visual, and functional inspection for all finished products.

Fast Delivery: Standard lead time of 3-15 days with just-in-time delivery options.

Wide Material Selection: Supports FR-4, CEM-1/3, Aluminum, Rogers, Polyimide, and other specialized substrates.

Multi-Layer Capability: Manufactures rigid boards with 1 to 32 layers and complex blind/buried vias.

Diverse Surface Finishes: Offers HASL, ENIG, OSP, Immersion Silver/Tin, and Hard Gold options.

High Precision Specs: Supports trace width/space as small as 3 mils and hole sizes down to 0.1mm.

Professional Engineering: Backed by experienced engineers for technical support and substitute solutions.

Company profile

Importers and ExportersExhibition ExperienceFast DeliveryStandardized quality control

Shenzhen New Chip international Ltd

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 4 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.76h

AI-Powered supplier vetting

SummaryShenzhen New Chip International Ltd, established in 2022, is a Chinese trading company involved in the electrical and electronics sector with a focus on PCBA, ODM, and electronic components. It is wholly owned by H. C. C. International Limited, which has been operating since 2004. The company exports a significant portion of its products, with 51%-70% of total sales from exports. The company operates over ten production lines and has its factory located in Shenzhen, Guangdong Province. Despite being a new entity, it benefits from the experience and infrastructure of its parent company.

Supplier typeThe supplier is a trading company located in Shenzhen, China, operating under the name Shenzhen New Chip International Ltd and classified as a limited company.

R&D capabilityThe company emphasizes innovation as a core value, and its parent company is involved in the Made in China 2025 initiative, indicating a focus on innovation.

Production capacityThe supplier has over ten production lines and a production output value distribution focused on PCBA services, indicating strong production capabilities.

Customization capabilityThere is mention of various PCBA processes, suggesting some level of customization capability in production processes.