Customization
AvailableType
Rigid Circuit BoardFlame Retardant Properties
V2Model NO.
OKEYPCBADielectric
AINBase Material
CopperInsulation Materials
Organic ResinProcessing Technology
Electrolytic FoilApplication
AerospaceMechanical Rigid
RigidMaterial
Paper Phenolic Copper Foil SubstrateBrand
OkeyShape
Retangular, Round, Slots, Cutouts, Complex, IrregSurface Finishing
OSP, Immersion Gold, Immersion Tin, Immersion AGLayer
1-60 LayersService
Turnkey Assembly PCB ServiceOther Capabilities
Repair/Rework Services Mechanical Assembly Box BuiCopper Thickness
1-10ozMin. SMD Size
01005QA Inspection
QA Inspection and Ect.Certificate
ISO9001, ISO14000, Ts16949.UL.RoHSOrder Qty
No LimitedCondition
NewControlling Range
-40c~125cSolder Resist Color
Green;Red;Yellow;Black;White and Ect.Surface Finishedc
HASL, Gold Finger, OSP, Enig, Peelable MaskTrade Mark
OEM, ODMTransport Package
Inner Vacuum Packing and Outer by CartonsSpecification
FR4, 1.6mm, multiLayer, 1OZ Copper ThicknessTrademark
OKEYOrigin
Guangdong Shenzhen, ChinaHS Code
85340090Production Capacity
Output 20 000 Square Meter Per Month