Comprehensive Turnkey Solutions: Full service from PCB fabrication to SMT/DIP assembly, component sourcing, and testing.
Flexible MOQ Policy: No minimum order quantity; supports both sample orders and mass production.
Advanced Manufacturing Capability: 8 automated SMT lines, 1 DIP wave line, and high-precision automated equipment.
Strict Confidentiality Protection: NDAs signed to protect client IP and commercial secrets throughout the process.
Wide Material Selection: Supports FR-4, High Tg, Aluminum, Ceramic, Copper, Halogen-free, Rogers, and Arlon.
High Precision Specifications: Min hole size 0.1mm (laser), min line spacing 0.075mm, thickness up to 7.0mm.
Fast Turnaround Time: Same-day service available; standard lead time within 15 workdays.
Rigorous Quality Testing: Includes ICT, FCT, AOI, X-ray, thermal shock, and vibration testing.