High Temperature Resistance: Resists up to 320 degrees Celsius with PI insulation and copper conductivity.
Customizable Specifications: Various thicknesses and sizes available, including single and double-sided options.
Versatile Applications: Suitable for digital products, LCD screens, mobile phones, and aerospace.
Flame Retardant V0: Meets V0 flame retardant properties for enhanced safety.
Electrolytic Foil Processing: Manufactured using electrolytic foil technology for high quality.
Epoxy Resin Adhesive: Coated with high-temperature resistant epoxy resin adhesive.
Polyimide Base Material: Constructed with durable polyimide insulation film.
Flexible Copper Clad Laminate: Serves as the processing substrate for Flexible Printed Circuit Boards.