Turnkey One-Stop Service: Comprehensive solution from PCB design, fabrication, component sourcing to assembly and packaging.
Massive Assembly Capacity: SMT capacity of 30 million points per day and DIP capacity of 100,000 pieces per day.
Medical Grade Quality: Meets IPC-A-610 Class 2/3 standards and holds ISO 13485:2016 certification for medical devices.
No Minimum Order Quantity: Supports both prototype and mass production with no MOQ restrictions.
Comprehensive Testing: Includes 3D SPI, 3D AOI, X-ray, Flying Probe, ICT, FCT, and Burn-in tests.
Advanced Component Support: Handles passive components as small as 0201 and fine-pitch BGA with 0.2mm pitch.
Global Logistics Options: Accepts FOB, CIF, EXW terms and multiple currencies including USD and CNY.