China Wafer Biscuit Automatic Packaging Machine

Name: China Wafer Biscuit Automatic Packaging Machine
Brand: Qingdao Sanweihe Machinery Manufacture Co., Ltd.
SKU: 695788332

Shandong, ChinaQingdao Sanweihe Machinery Manufacture Co., Ltd.

US$21,600.00

1-4 Pieces

US$21,000.00

5+ Pieces

Product profile

Customization

Available

After-sales Service

Yes

Warranty

12 Months

Model NO.

SWH-7017

Applicable Goods

Film Packing

Type

Automatic Wrapping Machine

Driven Type

Electric

Automatic Grade

Semi-Automatic

Inclusion Degree

Fully Wrapped Winding Machine

Structure

No Pallet Wrapping Machine

Film Frame Structure

Pre Tension

Series

NT Series - No Pallet Wrapping Machine

Dimension(LWH)

4800mm*1100mm*1850mm

Package Form

Edge Folding Type

Usage

Biscuit Packaging

Keywords

Biscuit Packing Machine

Transport Package

Wooden Box Packing

Specification

Stainless steel

Trademark

SANWEIHE

Origin

Qingdao China

HS Code

8422303090

Production Capacity

10 Sets / Month

Company profile

Years of Export ExperiencePatents AwardedExhibition ExperienceOverseas Services

Qingdao Sanweihe Machinery Manufacture Co., Ltd.

Shandong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 17 years CertifiedNearest Port: Qingdao PortAverage Response Time: ≤2.94h

AI-Powered supplier vetting

SummaryThe supplier is identified as a combined company and a manufacturing-sector trading company located in Qingdao, China. It operates five production lines, reports inventory capability, and serves broad export markets, but has fewer than five quality-control staff and lacks continuous batch quantity reconciliation and written outsourcing procedures. Its R&D profile is comparatively strong: four R&D engineers, recent new products, ODM, SDK, multiple customization options, and available design documentation for audit. Service capabilities include debugging, maintenance, training, and installation, with complaint-handling procedures and records. However, there is no valid manufacturing-capacity contract with associated subcontractors, no overseas warehouse or showroom, no written service assessment or corrective-action procedures, and only one experienced export-trade staff member. No certification evidence or direct customer case details are provided.

After-Sales capabilityThe supplier provides debugging, maintenance, training, and equipment installation, and it has a clear customer-complaint procedure with records. However, it lacks overseas warehouses and showrooms, has no written corrective and preventive action procedures or records, and has no valid manufacturing-capacity contract with associated subcontractors, creating limitations in service infrastructure and formal control.

R&D capabilityThe supplier reports new products within the past year, four R&D engineers, ODM services, an available SDK, and audit-ready design input, output, review, verification, and validation documentation. The engineers also support customer-request confirmation, production technology, after-sales service, and new product development, providing explicit evidence of structured R&D capability.

Production capacityThe supplier operates five production lines, reports inventory capability, and provides output information for wrapping packing machines and packing machines, with broad export-market coverage. Nevertheless, it has fewer than five quality-control staff, does not continuously reconcile quantities for each batch or mass production, lacks a written outsourcing SOP, and has no valid contract with associated subcontractors, so production capacity is demonstrated but process controls have material weaknesses.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, flexible customization, ODM services, and an available SDK. These capabilities directly support both hardware/product adaptation and design-based development.