Over-Wrap Type Wafer Biscuit Automatic Packaging Machine

Name: Over-Wrap Type Wafer Biscuit Automatic Packaging Machine
Brand: Qingdao Sanweihe Machinery Manufacture Co., Ltd.
SKU: 729589402

Shandong, ChinaQingdao Sanweihe Machinery Manufacture Co., Ltd.

US$24,500.00

1-2 Pieces

US$23,500.00

3-4 Pieces

US$22,500.00

5-9 Pieces

US$22,000.00

10+ Pieces

Product profile

Customization

Available

After-sales Service

Yes

Warranty

12 Months

Model NO.

SWH-7017

Automatic Grade

Semi-Automatic

Application

Cosmetics, Dairy Products, Vegetable, Fruit, Fish, Meat

Type

Forming Filling Sealing Machine

Forming Species

Film Packing

Forming Function

Forming, Filling, Seal

Driven Type

Electric

Material Type

Solid

Packaging

Film Packing

Packaging Material

Film

Dimension(LWH)

4800*1100*1850mm

Brand Name

Sanweihe

Place of Origin

Qingdao China

Keywords

Wrapping Machine

Color

Silver Grey

OEM Service

Available

Paket Type

Over Wrapping Type

Transport Package

Wooden Box Packing

Specification

SGS

Trademark

SANWEIHE

Origin

Qingdao China

HS Code

8422303090

Production Capacity

6 Sets/Month

Company profile

Years of Export ExperiencePatents AwardedExhibition ExperienceOverseas Services

Qingdao Sanweihe Machinery Manufacture Co., Ltd.

Shandong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 17 years CertifiedNearest Port: Qingdao PortAverage Response Time: ≤3.31h

AI-Powered supplier vetting

SummaryThe supplier is identified as a combined company and a manufacturing-sector trading company located in Qingdao, China. It operates five production lines, reports inventory capability, and serves broad export markets, but has fewer than five quality-control staff and lacks continuous batch quantity reconciliation and written outsourcing procedures. Its R&D profile is comparatively strong: four R&D engineers, recent new products, ODM, SDK, multiple customization options, and available design documentation for audit. Service capabilities include debugging, maintenance, training, and installation, with complaint-handling procedures and records. However, there is no valid manufacturing-capacity contract with associated subcontractors, no overseas warehouse or showroom, no written service assessment or corrective-action procedures, and only one experienced export-trade staff member. No certification evidence or direct customer case details are provided.

After-Sales capabilityThe supplier provides debugging, maintenance, training, and equipment installation, and it has a clear customer-complaint procedure with records. However, it lacks overseas warehouses and showrooms, has no written corrective and preventive action procedures or records, and has no valid manufacturing-capacity contract with associated subcontractors, creating limitations in service infrastructure and formal control.

R&D capabilityThe supplier reports new products within the past year, four R&D engineers, ODM services, an available SDK, and audit-ready design input, output, review, verification, and validation documentation. The engineers also support customer-request confirmation, production technology, after-sales service, and new product development, providing explicit evidence of structured R&D capability.

Production capacityThe supplier operates five production lines, reports inventory capability, and provides output information for wrapping packing machines and packing machines, with broad export-market coverage. Nevertheless, it has fewer than five quality-control staff, does not continuously reconcile quantities for each batch or mass production, lacks a written outsourcing SOP, and has no valid contract with associated subcontractors, so production capacity is demonstrated but process controls have material weaknesses.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, flexible customization, ODM services, and an available SDK. These capabilities directly support both hardware/product adaptation and design-based development.