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14 Layer Fr4 High Density High Speed PCB Board for Blade Server, Dual Intel Xeon Mainboard PCB Support Pcie4.0 DDR4 16gbps
US$1.00-100.00
1 Piece

Product profile

Customization

Available

Mode of Production

SMT

Layers

Multilayer

Model NO.

RTPCBA 14L 2.5MM 16GBPS

Base Material

FR-4

Customized

Customized

Condition

New

Product Type

Industrial Blade Server Board

Transport Package

Carton

Origin

China

Key features

Documented industrial blade server board with 14-layer, 2.5 mm standard FR4 construction
Recorded parameters include 37000+ pins and a maximum rate of 16 Gbps
Configuration specifies dual Intel Xeon 5220 processors, six DDR4 interfaces, PCIe 4.0, and USB 3.0

Company profile

Nanjing Reach Top Communication Technology Co., Ltd.
Importers and ExportersHigh Repeat Buyers Choice
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤3.11h

AI-Powered supplier vetting

SummaryThe supplier, LINGDE, operates as a high-tech trade company specializing in RF solutions and is supported by its parent company's R&D capabilities. It lacks overseas presence and has no financial performance data from the past year, indicating potential financial limitations. Quality assurance processes are in place, but there are no written procedures for corrective actions or handling complaints. The company offers a range of customization services and ODM capabilities but does not engage with popular brands through OEM. While the supplier excels in R&D and provides professional RF solutions, its financial credibility, overseas expansion, and after-sales service capabilities are underdeveloped.
Supplier typeLINGDE is a high-tech trade company specializing in the R&D, production, and sales of RF modules, leveraging the capabilities of its parent company for global markets.
After-Sales capabilityNo written procedures or records for corrective actions or customer complaints, indicating a lack of formal after-sales service processes.
Financial creditThe supplier shows no operating revenue, costs, or profits for the last year, and financial ratios are zero, signaling potential financial instability.
R&D capabilityThe supplier has strong R&D capabilities, providing design and customization services but has not released new products in the last year.
Customization capabilityOffers extensive customization services, including ODM and flexible customization from designs and samples.

Product Q&A

Q:What is the product or service scope of this listing?
A:
This listing documents an industrial blade server board PCB assembly case rather than a general, pre-defined manufacturing package. The recorded board uses standard FR4, has 14 layers, and has a 2.5 mm thickness. Its documented architecture also includes dual Intel Xeon 5220 processors and six DDR4 memory interfaces. The source does not define production quantities, assembly stages, or separately supplied deliverables
Q:What configuration and deliverables are documented?
A:
The documented configuration identifies a dual Intel Xeon 5220 processor arrangement, six DDR4 memory interfaces, a PCIe 4.0 expansion interface, and USB 3.0. It also records a pin count of 37000+ and standard FR4 board material. No bill of materials, accessory list, software content, or separate shipment items are stated in the supplied parameters. Therefore, the available information describes the board configuration rather than a defined deliverables list
Q:What technical performance and design capability are specified?
A:
The parameter table gives a maximum rate of 16 Gbps and a pin count of 37000+ for this blade server board configuration. It also specifies 10 deg routing and Tap routing, together with a 14-layer, 2.5 mm standard FR4 board. These entries describe documented design parameters; they do not provide benchmark throughput, signal-integrity test results, or other measured performance data. No additional capability value is supplied
Q:Which interfaces and compatibility details are available?
A:
The specified board interfaces are six DDR4 memory interfaces, a PCIe 4.0 expansion interface, and USB 3.0. The processing arrangement is listed as dual Intel Xeon 5220, which is part of this documented configuration. The source does not state compatibility with particular chassis, operating systems, peripherals, or external devices. Interface matching should therefore be evaluated against these listed interfaces rather than assumed from the case description
Q:What information should be confirmed for selection or inquiry?
A:
For selection, compare required board construction and interfaces with the recorded 14-layer, 2.5 mm standard FR4 configuration, six DDR4 interfaces, PCIe 4.0, and USB 3.0. The documented board also has dual Intel Xeon 5220 processors, 37000+ pins, and a stated maximum rate of 16 Gbps. The supplied information does not identify alternate configurations, overall dimensions, or a production-delivery scope. These unspecified points should be confirmed for an inquiry

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