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2024 Hot Sale OEM ODM MID Tower ATX Desktop Gaming PC Case
US$20.00-25.00
500 Pieces
Sample price:US$20.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
ATXPower Supply
Without Power SupplyModel NO.
Segotep Gank 5Case Structure
ATXType
TowerMaterial
Steel plateColor
Black or White or PinkFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.6mmTransport Package
CartonSpecification
550mm*287mm*482mmTrademark
SegotepOrigin
ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
OEM/ODM Customization: Full customization, minor customization, and flexible customization options available from samples or designs.
Tempered Glass Side Panel: 0.7mm SPCC transparent tool-free glass side panel for excellent view of RGB components.
Advanced Cable Management: 200mm back cable space with dedicated holes for easy and intuitive wiring.
Dust-Proof Design: Pull-out dustproof filters on upper/lower parts and magnetic net on front panel.
Easy Installation: Removable mesh front panel and magnetic side glass for quick dismantle and assembly.
High-Quality Material: Constructed with 1.0mm front steel plate and 0.6mm sheet thickness for durability.
ATX Compatibility: Compatible with ATX mainboards and supports graphics cards up to 300-400mm.
Color Options: Available in Black, White, or Pink to match various aesthetic preferences.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What customization options are available?
A:
We offer full customization, minor customization, flexible customization, and options to customize from samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:What are the lead times for production?
A:
During peak season, lead time is one month. During off-season, it is within 15 workdays.
Q:Does the case support large graphics cards?
A:
Yes, it supports graphics cards with a maximum length of 300-400mm.
Q:Is the side panel removable?
A:
Yes, the tempered glass side panel is tool-free and magnetic for easy removal.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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