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2024 with USB3.0 Massive Cooling Compatibility Computer Cases Canada
US$50.80
500-9,999 Boxes
US$49.30
10,000-19,999 Boxes
US$48.00
20,000-49,999 Boxes
US$45.80
50,000+ Boxes
Sample price:US$50.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
All ATX,Micro ATX,ItxPower Supply
Without Power SupplyModel NO.
K3Case Structure
ATXType
TowerMaterial
0.8mm Main StructureColor
BlackFront Interface
USB3.0+USB2.0+HD AduioCable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.5mmFan
Front:2*14cm Fan / 3*12cm Rear:2*12cm Fan / 2*1Name
2020 with USB3.0 Massive Cooling Compatibility COMTransport Package
CantonSpecification
470*215*483mmTrademark
SEGOTEPOrigin
ChinaProduction Capacity
1000000Key features
Massive Cooling Compatibility: Supports up to 2*14cm front fans and multiple rear/top options for superior airflow.
Premium Build Quality: 0.8mm main structure with 0.5mm sheet thickness ensures durability and stability.
Versatile Motherboard Support: Compatible with all ATX, Micro ATX, and ITX motherboards for flexible builds.
Convenient Cable Management: Features back cable management design for clean and organized internal wiring.
User-Friendly Installation: Tool-free removal for front panel and tempered glass window simplifies assembly.
Extensive Connectivity: Front I/O includes 2x USB 3.0, 2x USB 2.0, and HD Audio for modern peripherals.
Flexible Customization: Offers full, minor, and flexible customization options from samples or designs.
Trusted Manufacturer: Segotep has 15 years of experience with advanced testing systems and automation.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard sizes are supported?
A:
This case supports all ATX, Micro ATX, and ITX motherboard specifications.
Q:What are the cooling fan options?
A:
It supports 2*14cm or 3*12cm fans at the front, 2*12cm fans at the rear, and 2*14cm fans at the top.
Q:Is customization available for this case?
A:
Yes, we offer full customization, minor customization, and flexible customization from samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:What is the lead time for production?
A:
Peak season lead time is one month, while off-season lead time is within 15 workdays.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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