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6 Disk Storage Server Ai Workstation GPU Computing Power Nas Case
US$10.00-88.00
300 Pieces

Product specifications

Carton

Sample price:US$75.00/piece.Request sample

Product profile

Customization

Available

Compatible Mainboard

E-ATX

Power Supply

Without Power Supply

Model NO.

Segotep Aeris WS1 Ultra

Case Structure

EATX

Type

Tower

Material

Steel plate

Color

Black

Front Interface

Type C*1+USB3.0*2

Cable Management

Back Cable Management

Maximum Lenght of Graphics Card

>400mm

Sheet Thickness

0.8mm

Transport Package

Carton

Specification

655*340*662mm(carton size)

Trademark

Segotep

Origin

China

Key features

Robust Steel Construction: 0.7mm SGCC hot-dip galvanized steel body with internal painting for sturdiness.
Efficient Cooling System: 200mm front fan supports 2x 12/14cm top fans + 240mm radiator for optimal airflow.
Broad Hardware Compatibility: Supports EATX/ATX dual-socket motherboards and multi-GPU setups like RTX 4090.
High Expandability: 8 full-height PCIe slots and hot-swap bays for 2.5''SSD*2 or 3.5''HDD*5.
Convenient Maintenance: Detachable top dust filter easily accessed via rear groove for easy cleaning.
OEM/ODM Service: Full, minor, and flexible customization available from samples or designs.
Premium Brand Quality: Segotep is a top 3 Chinese PSU manufacturer with 15 years of R&D experience.
Strict Quality Control: 100% finished product inspection with UL-tested raw materials and advanced testing.

Company profile

Segotep Electronic Technology Co., Ltd.
Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.

Product Q&A

Q:What motherboard types are supported?
A:
The case supports EATX and ATX dual-socket motherboards, including Xeon Scalable and 14th Gen Intel Core processors.
Q:Does the case support hard drive expansion?
A:
Yes, it offers hot-swap HDD/SSD bays supporting up to two 2.5'' SSDs or five 3.5'' HDDs.
Q:Is OEM or ODM service available?
A:
Yes, we provide full customization, minor customization, and flexible customization from samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:What are the lead times for production?
A:
Peak season lead time is one month, while off-season lead time is within 15 workdays.

Send Inquiry

*To:Segotep Electronic Technology Co., Ltd.Segotep Electronic Technology Co., Ltd.
*Content:
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