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ATX Mesh Panel Argb Lightin OEM MID Tower Hot Sell Desktop Case
US$8.00-16.00
100 Pieces
Sample price:US$15.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
ATXPower Supply
Without Power SupplyModel NO.
Segotep Snake 3Case Structure
ATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
<200mmSheet Thickness
0.45mmTransport Package
CartonSpecification
492mm*247mm*445mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
Superior Airflow Design: Stylish mesh panel with 8 fan positions ensures great airflow to reduce heat quickly.
ATX Compatibility: Fully compatible with all ATX motherboards for versatile gaming setup solutions.
OEM/ODM Service: Supports full, minor, and flexible customization from samples or designs.
Quality Assurance: 100% visual and function inspection for finished products with UL raw material reports.
Professional R&D: Backed by 22 R&D engineers and 15 years of experience in DIY computer hardware.
Certified Standards: Products hold FCC and CE certifications for global market compliance.
High Capacity Production: 50,000 sqm plant area with advanced automation ensures high annual output.
Flexible Lead Time: Off-season lead time within 15 workdays; peak season one month.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
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