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DIY MID Tower PC Chassis Plastic Mesh Panel Computer Case
US$10.00-20.00
500 Boxes
Sample price:US$16.00/piece.Request sample

Product profile

Customization

Available

Compatible Mainboard

MicroATX

Power Supply

Without Power Supply

Model NO.

Segotep LUX-S

Case Structure

MATX

Type

Tower

Material

Steel plate

Color

Black

Front Interface

USB3.0

Cable Management

Back Cable Management

Maximum Lenght of Graphics Card

300-400mm

Sheet Thickness

0.6mm

Fan

Front:12*3/14cm*2

Name

Acrylic Computer Case

Transport Package

Canton

Specification

360*205*405mm

Trademark

SEGOTEP

Origin

China

Production Capacity

1000000

Key features

Acrylic Side Panel Design: Features a stylish acrylic side panel for a modern look.
MicroATX and ITX Support: Compatible with Micro ATX and ITX motherboard types.
Flexible Cooling System: Supports front 240mm/280mm, top 240mm, and rear 120mm water coolers.
OEM and ODM Services: Offers full, minor, and flexible customization from samples or designs.
High-Quality Steel Construction: Constructed with 0.6mm steel plate for durability.
Efficient Cable Management: Includes back cable management system for clean internal layout.
Multiple Storage Options: Supports 2x 3.5 HDD or 1x 3.5 HDD + 2x 2.5 SSD in bottom bay.
USB 3.0 Front Interface: Equipped with 1x USB 3.0 and 2x USB 2.0 ports plus HD Audio.

Company profile

Segotep Electronic Technology Co., Ltd.
Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.

Product Q&A

Q:What motherboard types are supported?
A:
This chassis supports Micro ATX and ITX motherboard types.
Q:What are the cooling options?
A:
It supports front 240mm/280mm, top 240mm, and rear 120mm water coolers, plus 2x 12cm/14cm fans at the front and 2x 12cm/14cm at the top.
Q:Can I customize this product?
A:
Yes, we offer full, minor, and flexible customization from samples or designs, including OEM and ODM services.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:What is the lead time for production?
A:
Lead time is within 15 workdays during off-peak season and one month during peak season.

Send Inquiry

*To:Segotep Electronic Technology Co., Ltd.Segotep Electronic Technology Co., Ltd.
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