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DIY Steel Front Panel Case, Matx Gaming PC Case
US$3.00-15.00
300 Pieces
Sample price:US$15.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
MicroATXPower Supply
Without Power SupplyModel NO.
Segotep Prime DCase Structure
MATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
200-300mmSheet Thickness
0.5mmPSU Length
Max 150mmGPU Length
Max 290mmCPU Cooler Height
Max 160mmPcie Slots
4Transport Package
CartonSpecification
332*200*385mmTrademark
SegotepOrigin
ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
OEM/ODM Customization: Supports full customization, minor customization, and flexible customization from samples or designs.
Premium Build Quality: Constructed with 0.5mm steel plate, ensuring durability and stability for DIY gaming setups.
Compact MATX Design: MicroATX tower structure compatible with M-ATX and ITX motherboards, saving space.
High-Speed Connectivity: Features USB 3.0 and USB 2.0 ports for fast data transfer and device connectivity.
Efficient Cable Management: Designed with back cable management system for a clean and organized interior.
Trusted Manufacturer: Produced by Segotep, a top 3 power supply manufacturer with 15 years of industry experience.
Rigorous Quality Control: 100% finished product inspection including visual and function checks by 14 QA inspectors.
Global Certifications: Products certified with FCC and CE, meeting international safety and quality standards.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard sizes are compatible?
A:
This case supports MicroATX (MATX) and ITX motherboards.
Q:Does the case include a power supply?
A:
No, the power supply is not included. You need to purchase it separately.
Q:Is OEM or ODM service available?
A:
Yes, we offer OEM and ODM services, including full customization, minor customization, and flexible customization from samples or designs.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 pieces.
Q:What are the payment terms?
A:
We accept T/T (Telegraphic Transfer) and LC (Letter of Credit).
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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