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E-ATX The Max Glass Side Panel 360 Water Cooler on Top Gaming Case
US$12.00-25.00
500 Pieces

Product specifications

Carton

Product profile

Customization

Available

Compatible Mainboard

E-ATX

Power Supply

Without Power Supply

Model NO.

Segotep Rambo 360Q

Case Structure

EATX

Type

Tower

Material

Steel plate

Color

Black

Front Interface

USB3.0

Cable Management

Back Cable Management

Maximum Lenght of Graphics Card

300-400mm

Sheet Thickness

0.7mm

Transport Package

545mm*262mm*520mm

Specification

443mm*210mm*465mm

Trademark

Segotep

Origin

China

HS Code

84733090

Key features

E-ATX Compatibility: Supports E-ATX motherboards for expanded build options.
360mm Water Cooling: Top and front panels support 360mm liquid coolers.
Tempered Glass Side: Features a side tempered glass panel for aesthetic display.
High-Quality Build: Constructed with 0.7mm SPCC steel plate for durability.
Flexible Customization: Offers full, minor, and flexible customization options.
Multiple Storage Options: Supports 2-3 3.5 HDDs and 3 2.5 SSDs for ample storage.
Rich Connectivity: Includes USB 3.0, USB 2.0, and HD Audio front ports.
Professional Manufacturer: Produced by Segotep with 15 years of industry experience.

Company profile

Segotep Electronic Technology Co., Ltd.
Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.

Product Q&A

Q:Does this case support E-ATX motherboards?
A:
Yes, the case is compatible with E-ATX, ATX, M-ATX, and ITX motherboards.
Q:Can I install a 360mm water cooler?
A:
Yes, both the front and top panels support 360mm water coolers.
Q:Is OEM or ODM service available?
A:
Yes, we provide OEM, ODM, and various customization options including full and minor customization.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:What are the lead times for production?
A:
Peak season lead time is one month, while off-season lead time is within 15 workdays.

Send Inquiry

*To:Segotep Electronic Technology Co., Ltd.Segotep Electronic Technology Co., Ltd.
*Content:
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