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Flat Panel Gaming Desktop PC Case, Eatx Motherboard Compatible
US$8.00-23.00
500 Pieces
Product specifications
Carton
Sample price:US$23.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyModel NO.
Segotep Rambo 360DCase Structure
EATXType
TowerMaterial
Steel plateColor
Black or WhiteFront Interface
USB3.0*1+USB2.0*2Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.8mmTransport Package
Carton BoxSpecification
526mm*285mm*516mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
E-ATX Compatibility: Supports E-ATX motherboards with a tower structure design.
Premium Steel Build: Constructed from 0.8mm thick steel plate for durability.
Flexible Color Options: Available in Black or White color choices.
Convenient Connectivity: Features USB 3.0 and dual USB 2.0 front interfaces.
OEM/ODM Support: Offers full and minor customization from samples or designs.
Quality Assurance: 100% visual and function inspection with UL raw material reports.
Established Manufacturer: 20 years experience with 332 employees and ISO certified processes.
Global Certification: Products certified with FCC and CE standards for global markets.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard sizes are supported?
A:
This case is compatible with E-ATX motherboards and features an E-ATX case structure.
Q:What is the material and thickness of the case?
A:
The case is made of steel plate with a sheet thickness of 0.8mm.
Q:What color options are available?
A:
The case is available in Black or White.
Q:Does the case include a power supply?
A:
No, the power supply is not included with the case.
Q:What are the front interface ports?
A:
It includes one USB 3.0 port and two USB 2.0 ports on the front.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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