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Gaming Mesh Front Panel Desktop Computer Case Dust-Proof Chassis
US$12.00-15.00
500 Pieces
Sample price:US$12.00/piece.Request sample

Product profile

Customization

Available

Compatible Mainboard

MicroATX

Power Supply

Without Power Supply

Model NO.

Segotep Prime G

Case Structure

MATX

Type

Tower

Material

Steel plate

Color

Black with Red or Green

Front Interface

USB3.0

Cable Management

Back Cable Management

Maximum Lenght of Graphics Card

200-300mm

Sheet Thickness

0.5mm

Transport Package

Carton

Specification

427mm*250mm*397mm

Trademark

Segotep

Origin

Huizhou City, Guangdong Province, China

HS Code

8473309000

Production Capacity

1000000/Per Year

Key features

Superior Airflow Design: 38mm air intake grill front panel with 33mm space for double fan installation.
Flexible Storage Options: Includes 2.5 SSD slot and removable cage for 3.5 HDD or 2.5 SSD.
RGB Gaming Compatibility: Transparency acrylic side panel provides wonderful view for RGB setups.
Multi-Fan Support: Supports up to seven 120mm fans for enhanced cooling.
Dust-Proof Mesh Front: Mesh front panel design effectively prevents dust entry.
Back Cable Management: Dedicated back cable management system for clean interior.
OEM and ODM Services: Offers full, minor, and flexible customization from samples or designs.
High-Quality Steel Construction: Made of 0.5mm steel plate for durability and stability.

Company profile

Segotep Electronic Technology Co., Ltd.
Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.

Product Q&A

Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:What is the lead time for production?
A:
Peak season lead time is one month, while off-season lead time is within 15 workdays.
Q:Does this case come with a power supply?
A:
No, the power supply is not included with this chassis.
Q:What motherboard sizes are compatible?
A:
This case supports MicroATX (MATX) motherboards.
Q:Is customization available for this product?
A:
Yes, we offer full customization, minor customization, and flexible customization from samples or designs.

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