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Latest Desktop AMD Intel CPU Copper Heatsink Radiator
US$9.80
500-999 Pieces
US$7.80
1,000-1,999 Pieces
US$6.50
2,000-4,999 Pieces
US$6.10
5,000+ Pieces
Sample price:US$10.00/piece.Request sample

Product profile

Customization

Available

Application

Desktop

Type

CPU Cooler

Heatsink Material

Aluminum

Intelligent Temperature Control

Support Intelligent Temperature Control

Noise

Mute

CPU Type

Intel

Fan Bearing

Hydro Bearing

Tube Numbers

4

Multi-Angle

With Multi-Angle

Feature

Built-in Speaker

Name

Computer Host CPU Mute Radiator RGB Cool Fan T2 Co

Transport Package

Carton

Specification

92*77*130mm

Trademark

SEGOTEP

Origin

China

Production Capacity

1000000

Key features

Hydro Bearing Technology: Features hydraulic mute bearing for stable operation and extended lifespan.
High Efficiency Cooling: 99.9% pure aluminum and pure copper heat pipes for superior heat dissipation.
Broad Compatibility: Supports Intel LGA1151 and AMD AM4/AM3/FM2 socket types.
Integrated Speaker: Built-in speaker feature adds unique audio functionality to the cooler.
Customization Options: Offers full, minor, and flexible customization from samples or designs.
Professional Manufacturer: Segotep has 15 years experience with advanced automation and testing systems.
Quality Assurance: 100% finished product inspection and UL raw material test reports.

Company profile

Segotep Electronic Technology Co., Ltd.
Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.

Product Q&A

Q:Which CPU sockets are supported?
A:
It supports Intel LGA1151 and AMD AM4, AM3, and FM2 sockets.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 PCS.
Q:Does the manufacturer offer OEM/ODM services?
A:
Yes, OEM and ODM services are available, including full and minor customization.
Q:What are the payment terms?
A:
Payment terms include T/T (Telegraphic Transfer) and LC (Letter of Credit).
Q:What is the lead time for production?
A:
Peak season lead time is one month; off-season lead time is within 15 workdays.

Send Inquiry

*To:Segotep Electronic Technology Co., Ltd.Segotep Electronic Technology Co., Ltd.
*Content:
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