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Magnetic Absorb Fast Dismantle Panel Front Mesh Panel Gaming Computer Case
US$29.00
100-299 Pieces
US$28.60
300-499 Pieces
US$28.00
500-999 Pieces
US$27.00
1,000+ Pieces
Sample price:US$30.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyModel NO.
GANK 360Case Structure
EATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.6mmTransport Package
CartonSpecification
461*221*488mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
013250Production Capacity
1000000Key features
Broad Motherboard Support: Compatible with E-ATX, ATX, M-ATX, and ITX motherboard specifications.
Extensive Cooling Options: Supports up to 360mm water cooling and multiple 12cm/14cm fans in front, top, and rear positions.
Flexible Storage Configuration: Supports up to 2x 3.5-inch HDDs and 4x 2.5-inch SSDs.
Comprehensive Customization: Offers full customization, minor customization, and flexible options from samples or designs.
Robust Build Quality: Constructed from 0.6mm steel plate with 100% visual and function inspection.
Global Brand Reputation: Top 3 PC component manufacturer established in 2003 with products in over 30 countries.
Certified Safety Standards: Products certified with FCC, CE, and UL raw material test reports.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard sizes does this case support?
A:
It supports E-ATX, ATX, M-ATX, and ITX motherboard specifications.
Q:Does this case support water cooling?
A:
Yes, it supports 240mm, 280mm, and 360mm water cooling radiators in the front and top positions.
Q:What are the storage capacity options?
A:
It can hold up to 2x 3.5-inch HDDs and 4x 2.5-inch SSDs.
Q:Is customization available for this product?
A:
Yes, we offer full customization, minor customization, and flexible options based on samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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