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Magnetic Dust-Proof Net Transmission Interface PC Gaming Computer Case
US$13.90
300-499 Boxes
US$14.50
500-999 Boxes
US$13.80
1,000-1,999 Boxes
US$13.00
2,000+ Boxes
Sample price:US$19.50/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
Matx/ItxPower Supply
Without Power SupplyCase Structure
ATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0*1+USB2.0*2+HD AduioCable Management
Back Cable ManagementMaximum Lenght of Graphics Card
200-300mmSheet Thickness
0.6mmFans Position
Front 12cm*3Pic Insert Slot
7Transport Package
CantonSpecification
309mm*200mm*385mmTrademark
SEGOTEPOrigin
ChinaHS Code
8473309000Production Capacity
1000000Key features
Premium Steel Construction: Durable 0.6mm SPCC steel chassis ensures structural integrity and longevity.
Versatile Motherboard Support: Compatible with both MATX and ITX motherboard types for flexible builds.
Advanced Front Connectivity: Equipped with USB 3.0, dual USB 2.0, and HD Audio ports for high-speed data transfer.
Flexible Fan Configuration: Supports multiple fan sizes (12cm/14cm) at front, top, and rear positions.
Water Cooling Ready: Front panel supports 240mm radiator installation for efficient liquid cooling.
Comprehensive Storage Bays: Includes 1x 3.5-inch HDD bay and 3x 2.5-inch SSD bays for ample storage.
OEM and ODM Services: Offers full customization, minor customization, and design-based customization options.
Certified Quality Assurance: Products hold FCC and CE certifications with 100% visual and functional inspection.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard types are compatible with this case?
A:
This case supports both MATX and ITX motherboard types.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:Does the case support water cooling?
A:
Yes, the front panel supports a 240mm water cooling radiator.
Q:Are OEM and ODM services available?
A:
Yes, we offer full customization, minor customization, and customization from samples or designs.
Q:What certifications does the product have?
A:
The product is certified with FCC and CE standards.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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