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Mesh Panel Matx Gaming Desktop PC Case with Handle
US$5.00-15.00
500 Pieces
Product profile
Customization
AvailableCompatible Mainboard
MicroATXPower Supply
Without Power SupplyModel NO.
Segotep Gremlin T100Case Structure
MATXType
TowerMaterial
Steel plateColor
Black or WhiteFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.6mmTransport Package
CartonSpecification
382*276*425mmTrademark
SegotepOrigin
ChinaKey features
Premium Build Quality: Constructed with 0.6mm steel plate, ensuring durability and stability for gaming setups.
Compact MATX Design: Supports MicroATX motherboards with a tower structure, ideal for space-efficient builds.
Flexible Customization: Offers full, minor, and flexible customization options from samples or designs.
Reliable Manufacturer: Backed by 15 years of experience and a professional R&D team with complete testing systems.
Color Options: Available in Black or White to match various desktop aesthetics.
Certified Quality: Products hold FCC and CE certifications, ensuring safety and compliance standards.
Efficient Production: Advanced automation and 100% finished product inspection guarantee consistent quality.
Strong Supply Chain: Trusted by Fortune 500 companies with 230 supply chain partners and 11 years of export experience.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
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Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
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