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Mesh Panel RGB Gaming Computer Case for 240/120 Water Cooling 3 Fans
US$12.50-15.00
500 Pieces
Sample price:US$13.00/piece.Request sample

Product profile

Customization

Available

Compatible Mainboard

MicroATX

Power Supply

Without Power Supply

Model NO.

Segotep Cyber H3

Case Structure

MATX

Type

Tower

Material

Steel plate

Color

Black

Front Interface

USB3.0

Cable Management

Back Cable Management

Maximum Lenght of Graphics Card

200-300mm

Sheet Thickness

0.5mm

Transport Package

Carton

Specification

470mm*244mm*430mm

Trademark

Segotep

Origin

China

HS Code

8473309000

Production Capacity

1000000/Per Year

Key features

RGB Mesh Front Panel: Features a stylish mesh design with RGB lighting support for enhanced aesthetics.
Water Cooling Support: Accommodates 240mm water coolers on top and 120mm coolers at the rear.
Back Cable Management: Designed with dedicated space for organized and clean cable routing.
MATX Case Structure: Optimized for MicroATX motherboards with a compact tower form factor.
OEM and ODM Services: Offers flexible customization options including samples, designs, and full customization.
High-Quality Steel Construction: Built with durable steel plate material and 0.5mm sheet thickness.
USB 3.0 Front Interface: Includes convenient USB 3.0 ports for high-speed data transfer.
Factory Direct Manufacturer: Produced by Segotep, a top 3 power supply manufacturer with 15 years of experience.

Company profile

Segotep Electronic Technology Co., Ltd.
Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a combined factory in Boluo County, Huizhou, operating in manufacturing. It demonstrates broad customization and R&D capabilities, including 3D software design, ODM, SDK availability, new product development, and documented R&D review, verification, and validation records. Production-related evidence includes multiple automated and testing facilities, while quality processes include standardized finished-product inspection, raw-material traceability, complaint handling procedures, and quality assurance. The supplier offers OEM services for well-known brands, but no specific customer names or cases are provided. It has participated in several offline trade shows and supports international quotation and payment terms, although no overseas warehouses, showrooms, agents, or branches are reported. Certification information and financial credibility evidence are not sufficient for assessment.
Supplier typeThe supplier is classified as a combined company and a factory, with its location in Boluo County, Huizhou. Its associated companies are in the manufacturing industry, indicating a manufacturing-oriented supplier structure.
After-Sales capabilityR&D engineers are responsible for technical support during production and after-sales service. The supplier also has a documented customer-complaint procedure with follow-up records, supporting an established after-sales and complaint-handling process.
R&D capabilityThe supplier reports new products within the past year, provides 3D software design, ODM services, and an available SDK. Its engineers handle new product development, and related design input, output, review, verification, and confirmation documents are available for audit, providing direct evidence of structured R&D capability.
Production capacityThe supplier operates as a manufacturing factory and reports automated inspection, screwing, packaging, wave soldering, and burn-in testing facilities. It also uses standardized finished-product inspection instructions, maintains written supplier-service procedures and corrective-action records, and reports lead times of within 15 workdays off-season and one month during peak season.
Customization capabilityThe supplier explicitly supports customization from samples and designs, full, minor, and flexible customization, as well as 3D software design and ODM services. This combination indicates broad product and design adaptation capability.

Product Q&A

Q:What motherboard sizes are compatible?
A:
This case is designed for MicroATX motherboards.
Q:Does the case come with a power supply?
A:
No, the power supply is not included with this case.
Q:Can I customize this product?
A:
Yes, we offer OEM and ODM services including customization from samples, designs, and full customization options.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:What are the lead times for production?
A:
During peak season, lead time is one month; during off-season, it is within 15 workdays.

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*To:Segotep Electronic Technology Co., Ltd.Segotep Electronic Technology Co., Ltd.
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