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Product profile
Customization
AvailableCompatible Mainboard
MicroATXPower Supply
Without Power SupplyModel NO.
Segotep Lumi IICase Structure
MATXType
TowerMaterial
Steel plateColor
Black or WhiteFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
>400mmSheet Thickness
0.6mmI/O Interface
USB3.0*1+USB2.0*2+HD AudioioTop
12cm*3/14cm*2(Support 240/280/360 Water Cooler)Motherboard Plate
12cm"2/14cm"2(Support 240280 Water Cooler)Bottom
12cm*3(Support 240/380 Water Cooler)Rear
12cm*1Transport Package
CartonSpecification
410mm*345mm*520mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
Double Tempered Glass: Features double 4mm tempered glass panels for maximum visibility of internal components.
Extensive Cooling Support: Supports 240/280/360mm water coolers and up to 9 fans for high-performance setups.
Large Cable Management: Provides 95mm of back cable management space for clean and organized wiring.
High-End GPU Support: Accommodates graphics cards longer than 400mm for high-end gaming configurations.
Premium Build Quality: Constructed from 0.6mm steel plate with rigorous quality control and testing.
Flexible Customization: Offers full customization options including I/O interfaces and fan configurations.
Trusted Manufacturer: Produced by Segotep, a top 3 Chinese manufacturer with 15 years of industry experience.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard form factors are supported?
A:
This case is compatible with MicroATX motherboards and features a MATX case structure.
Q:Does the case include a power supply?
A:
No, the power supply is not included with the case; it must be purchased separately.
Q:What cooling options are available?
A:
It supports up to 9 fans and 240/280/360mm water coolers on the top or internal board.
Q:Is customization available for this product?
A:
Yes, we offer full customization, minor customization, and flexible options based on samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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