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Segotep 2024 Matx Cube Case, Desktop Gaming PC Glass Chassis
US$12.50-18.20
500 Boxes
Sample price:US$22.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
Matx/ItxPower Supply
Without Power SupplyModel NO.
Segotep Brave W1Case Structure
MATXType
TowerMaterial
Steel plateColor
Black or WhiteFront Interface
USB3.0*1+USB2.0*1+HD AduioCable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.5mmPcie Slot
4PCTransport Package
CantonSpecification
368*324*402mmTrademark
SEGOTEPOrigin
ChinaHS Code
8473309000Production Capacity
1000000Key features
Convenient Side Panel: Sliding side panel design allows for easy and convenient component installation.
Powerful Cooling System: Supports up to 7 fans and is compatible with 240mm water coolers at the top.
MATX Structure: Compact tower case structure compatible with MATX and ITX motherboards.
Flexible Customization: Offers full customization, minor customization, and flexible options based on samples or designs.
Premium Material: Constructed from durable steel plate with a thickness of 0.5mm.
Rich Connectivity: Front interface includes USB 3.0, USB 2.0, and HD Audio ports.
Brand Reliability: Segotep products comply with 10+ certification standards including UL, TUV, and CE.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
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