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Segotep BS3 Slim Case, Office High Quality Computer Case
US$8.00-18.00
500 Pieces
Sample price:US$18.00/piece.Request sample

Product profile

Customization

Available

Compatible Mainboard

MicroATX

Power Supply

Without Power Supply

Model NO.

Segotep BS3

Case Structure

MATX

Type

Tower

Material

Steel plate

Color

Silver

Front Interface

USB3.0

Cable Management

Back Cable Management

Sheet Thickness

0.7mm

Transport Package

Carton

Specification

442*207*448mm

Trademark

Segotep

Origin

Huizhou City, Guangdong Province, China

HS Code

8473309000

Production Capacity

1000000/Per Year

Key features

Slim 13L Design: Compact 13L slim size with high-end outlook design suitable for office use.
MATX Compatibility: Supports MicroATX motherboards for versatile build options.
High-Speed Interfaces: Equipped with 2x USB3.0 and 2x USB2.0 ports for fast data transfer.
Durable Steel Build: Constructed from 0.7mm thick steel plate for stability and longevity.
Back Cable Management: Features back cable management for a clean and organized interior.
Customization Options: Offers full customization, minor customization, and flexible design options.
Professional Brand: Segotep has over 20 years of experience in high-quality gaming PC products.
Quality Assurance: 100% inspection for finished products including visual and function checks.

Company profile

Segotep Electronic Technology Co., Ltd.
Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.

Product Q&A

Q:What is the maximum motherboard size supported?
A:
The case supports MicroATX (MATX) motherboards.
Q:Does the case include a power supply?
A:
No, the power supply is not included with the case.
Q:What are the available customization options?
A:
We offer customization from samples, designs, full customization, minor customization, and flexible customization.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 PCS.
Q:What are the payment terms?
A:
We accept T/T (Telegraphic Transfer) and LC (Letter of Credit).

Send Inquiry

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