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Segotep Eatx Cube Shape Case, Full Tempered Glass Panel Case
US$10.60-48.00
500 Pieces
Sample price:US$50.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyModel NO.
Segotep VistaCase Structure
EATXType
TowerMaterial
Steel plateColor
WhiteFront Interface
USB3.0Cable Management
Non Back Cable ManagementMaximum Lenght of Graphics Card
>400mmSheet Thickness
0.6mmTransport Package
517mm*375mm*555mmSpecification
473mm*285mm*445mmTrademark
SegotepOrigin
ChinaHS Code
8473309000Production Capacity
10000Key features
Full Tempered Glass Design: Features a full tempered glass panel for a premium aesthetic look.
E-ATX Motherboard Support: Compatible with E-ATX, ATX, M-ATX, and ITX motherboards.
Extensive Cooling Options: Supports up to 360mm water coolers and multiple 12/14cm fans.
Large GPU Clearance: Accommodates graphics cards up to 435mm in length.
Rich Connectivity: Front I/O includes USB 3.0, USB 2.0, Type-C, and HD Audio.
OEM/ODM Customization: Offers full customization from samples, designs, and minor adjustments.
Ample Storage Capacity: Supports 4x 3.5'' HDDs and 4x 2.5'' SSDs for data storage.
Certified Quality: Products hold FCC and CE certifications for safety and compliance.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard sizes are supported?
A:
This case supports E-ATX, ATX, M-ATX, and ITX motherboards.
Q:Does it support water cooling?
A:
Yes, it supports up to 360mm water coolers in the top and rear positions.
Q:What are the front I/O ports?
A:
It features 2x USB 2.0, 2x USB 3.0, 1x Type-C, and HD Audio ports.
Q:Is OEM or ODM service available?
A:
Yes, we offer OEM and ODM services including full customization from samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity (MOQ) is 500 pieces.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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