Segotep Export to Germany-80 Plus Gold Full Modular 550W 650W 750W 850W -Big Capacitor-DC-DC Circuit-Gaming PC Computer Power Supply

Name: Segotep Export to Germany-80 Plus Gold Full Modular 550W 650W 750W 850W -Big Capacitor-DC-DC Circuit-Gaming PC Computer Power Supply
Brand: Segotep Electronic Technology Co., Ltd.
SKU: 1914462135

Guangdong, ChinaSegotep Electronic Technology Co., Ltd.

US$105.00

100-299 Pieces

US$104.20

300-499 Pieces

US$104.00

500+ Pieces

Product profile

Customization

Available

Use

Desktop

Certification

CE, RoHS, CCC, FCC, UL

Power

1250W

ATX Standard

ATX 12V 2.0

Fan Type

14cm

Fan Size

≥14"

Feature

Module

Hard Disk Interface

≥8

80PLUS Certification

80 PLUS Gold

Modular

Name

Computer Parts ATX Power Supply Gaming Power Suppl

Multiple Protections Function

Ovp, Uvp, OPP, SCP

Safety Approve

CE, FCC, CB, RoHS

Mainboard 20+4pin

PCI-E 6+2pin

CPU4+4pin

Conversion Efficiency

93.13%

SATA

IDE

Transport Package

Big Boxs K=K; RoHS

Specification

A-PFC/80PLUS Golden 1250W

Trademark

SEGOTEP

Origin

China

Production Capacity

1000000

Company profile

Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification

Segotep Electronic Technology Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.

Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.

After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.

R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.

Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.

Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.