Segotep Full Modular GM750W White Platinum 80 Plus Gold Switching Power Supply

Name: Segotep Full Modular GM750W White Platinum 80 Plus Gold Switching Power Supply
Brand: Segotep Electronic Technology Co., Ltd.
SKU: 1965796415

Guangdong, ChinaSegotep Electronic Technology Co., Ltd.

US$50.00-55.00

100 Pieces

Product profile

Customization

Available

Use

Desktop

Certification

CE, RoHS, CCC, FCC, UL

Power

750W

ATX Standard

ATX 12V 2.0

Fan Type

12cm

Fan Size

≥14"

Feature

Active PFC

Hard Disk Interface

≥8

80PLUS Certification

80 PLUS Gold

Modular

Not Modular

Name

Export-Icd Faridabad-LLC Resonance Power Supply

Multiple Protections Function

Ovp, Uvp, OPP, SCP

Safety Approve

CE, FCC, CB, RoHS

Motherboard 20+4pin

PCI-E 6+2pin Interface

8(6+2)Pin*4

CPU4+4pin Interface

8(4+4)Pin*2

Conversion Efficiency

92.5%

SATA

Weight

2kg

D 4pin Interface

Input Voltage

100V-240V

Size

150*140*85mm

Transport Package

Big Boxs K=K; RoHS

Specification

A-PFC/80PLUS Golden 750W

Trademark

SEGOTEP

Origin

China

HS Code

8504401300

Production Capacity

1000000

Company profile

Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification

Segotep Electronic Technology Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.

Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.

After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.

R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.

Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.

Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.