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Segotep Gank 3 RGB Strip Light Panel, Mesh Front Panel and Arylic Side Window, Support Multi SSD & HDD, Support 120mm/140mm Fan, Back Cable Management, PC Case
US$21.50-25.00
500 Pieces
Sample price:US$21.50/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
ATXPower Supply
Without Power SupplyModel NO.
Segotep Gank 3Case Structure
ATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.5mmTransport Package
CartonSpecification
594mm*256mm*475mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
Professional Cable Management: Features I/O port storage box and rear velcro for intuitive wiring.
ARGB Lighting Mesh Panel: Front panel equipped with RGB lighting strips for aesthetic appeal.
Tempered Glass Side Panel: 0.7mm SPCC tool-free glass allows clear view of internal hardware.
Spacious Open Interior: Supports ATX motherboard, 360mm front/240mm rear radiators, and vertical GPU up to 323mm.
Dust-Proof Design: Includes pull-out filters and magnetic dust proof net on the front panel.
Customization Options: Offers full, minor, and flexible customization from samples or designs.
High-Quality Manufacturing: Produced by Segotep with 15 years experience and advanced testing systems.
Robust Material Construction: Made of steel plate with 0.5mm sheet thickness for durability.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:Does the case support water cooling?
A:
Yes, it supports up to 360mm water cooling radiators in the front or 240mm in the rear.
Q:Is the side panel tool-free?
A:
Yes, the 0.7mm SPCC transparent tempered glass side panel is tool-free for easy installation.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 PCS.
Q:Is OEM and ODM service available?
A:
Yes, the factory offers OEM and ODM services including full, minor, and flexible customization.
Q:What are the lead times for production?
A:
Peak season lead time is one month, while off-season lead time is within 15 workdays.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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