What is the lead time for orders?

During peak season, the lead time is one month; off-season lead time is within 15 workdays.

Does the case support 3.5-inch hard drives?

Yes, it supports up to 2 maximum 3.5-inch HDDs.

Segotep Gank 360 Magnetic Front Mesh Panel ATX Computer Case with Optimized Airflow Top 360 Water Cooling Glass Side Panel Chassis

Name: Segotep Gank 360 Magnetic Front Mesh Panel ATX Computer Case with Optimized Airflow Top 360 Water Cooling Glass Side Panel Chassis
Brand: Segotep Electronic Technology Co., Ltd.
SKU: 1920032975

Guangdong, ChinaSegotep Electronic Technology Co., Ltd.

US$28.70

100-299 Pieces

US$28.60

300-499 Pieces

US$28.00

500-999 Pieces

US$27.00

1,000+ Pieces

Sample price:US$30.00/piece.Request sample

Product profile

Customization

Available

Compatible Mainboard

E-ATX

Power Supply

Without Power Supply

Model NO.

GANK 360

Case Structure

EATX

Type

Tower

Material

Steel plate

Color

Black

Front Interface

USB3.0

Cable Management

Back Cable Management

Maximum Lenght of Graphics Card

300-400mm

Sheet Thickness

0.6mm

Transport Package

Carton

Specification

461*221*488mm

Trademark

Segotep

Origin

China

HS Code

013250

Production Capacity

1000000

Key features

Optimized Airflow Design: Features magnetic front mesh panel and glass side panel for superior cooling performance.

360mm Water Cooling Support: Front and top panels support 240mm, 280mm, and 360mm liquid cooling radiators.

E-ATX Motherboard Compatibility: Designed to accommodate E-ATX mainboards with ample internal space.

Premium Glass Panel: Equipped with a 4mm slide rail glass panel for aesthetic appeal and durability.

Flexible I/O Configuration: Standard USB3.0 and HD Audio; Optional Type-C and additional USB3.0 ports available.

Extensive Fan Support: Supports multiple 12cm and 14cm fans on front, top, rear, and internal locations.

OEM and ODM Services: Offers full customization, minor customization, and flexible customization options.

High-Quality Construction: Built with 0.8mm main SPCC structure and 0.6mm sheet thickness for stability.

Company profile

Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification

Segotep Electronic Technology Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.

Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.

After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.

R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.

Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.

Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.