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Segotep Highair 360-Argb ATX Gaming Desktop PC Case
US$10.00-38.00
300 Pieces
Product specifications
Carton
Sample price:US$30.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyModel NO.
Segotep Gank 360Case Structure
EATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.6mmTransport Package
CartonSpecification
461*221*488mmTrademark
SegotepOrigin
ChinaProduction Capacity
1000000Key features
Premium Glass Panel: Features a 4mm slide rail glass panel for a sleek and modern aesthetic.
Extensive Cooling Support: Supports 240mm/280mm/360mm water-cooling on front and top panels.
High Compatibility: Compatible with E-ATX motherboards and graphics cards up to 390mm.
Flexible I/O Options: Offers standard USB3.0/HD Audio or optional Type-C/USB3.0 configurations.
Robust Construction: Built with 0.8mm main SPCC structure for durability and stability.
Professional OEM/ODM: Supports full customization from samples, designs, or minor adjustments.
Quality Assurance: 100% visual and function inspection with UL-certified raw materials.
Trusted Manufacturer: Segotep is a top 3 power supply manufacturer with 15 years of experience.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:Does this case support water cooling?
A:
Yes, it supports 240mm, 280mm, and 360mm water-cooling radiators on both the front and top panels.
Q:What motherboard formats are compatible?
A:
The case is compatible with E-ATX motherboards.
Q:Is OEM or ODM service available?
A:
Yes, we offer OEM and ODM services including full customization from samples or designs.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 PCS.
Q:What are the payment terms?
A:
We accept T/T and LC as terms of payment.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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