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Segotep Support High End Graphics Card PC Gaming Case Tempered Glass
US$27.00-31.00
100 Pieces
Sample price:US$35.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyModel NO.
GANK360Case Structure
EATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
>400mmSheet Thickness
0.6mmTransport Package
Carton BoxSpecification
461*221*488mmTrademark
SegotepOrigin
ChinaHS Code
84733090Production Capacity
1000000Key features
E-ATX Compatibility: Supports E-ATX mainboards with a case structure designed for large form factors.
Extensive Cooling Support: Front and top support up to 360mm water-cooling radiators for optimal thermal performance.
Tempered Glass Panel: Features a 4mm slide rail glass panel for a premium aesthetic and clear internal visibility.
Flexible I/O Options: Standard USB 3.0 and HD Audio, with optional Type-C and additional USB 3.0 ports.
Magnetic Fast Dismantle: Features magnetic absorb fast dismantle panels for easy access and maintenance.
Vertical VGA Installation: Supports vertical installation of 3 slots VGA cards for modern display setups.
OEM/ODM Customization: Offers full customization, minor customization, and flexible customization options.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:Does this case support water cooling?
A:
Yes, it supports front and top mounting of 240mm, 280mm, and 360mm water-cooling radiators.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 PCS.
Q:Is OEM or ODM service available?
A:
Yes, the manufacturer offers OEM, ODM, full customization, minor customization, and flexible customization services.
Q:What are the payment terms?
A:
Payment terms include T/T (Telegraphic Transfer) and LC (Letter of Credit).
Q:What is the lead time for production?
A:
Peak season lead time is one month, while off-season lead time is within 15 workdays.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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