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Segotep Zack Tempered Glass Side Panel Full Tower ATX Gaming PC Computer Case
US$26.50
100-299 Pieces
US$25.80
300-499 Pieces
US$24.10
500-999 Pieces
US$23.50
1,000+ Pieces
Sample price:US$28.50/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyModel NO.
C8Case Structure
EATXType
TowerMaterial
Steel plateColor
SilverFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.6mmTransport Package
CartonSpecification
L430*W218*H480mmTrademark
SegotepOrigin
ChinaHS Code
013250Production Capacity
1000000Key features
Full Tower ATX Compatibility: Supports E-ATX, ATX, M-ATX, and ITX motherboards for versatile system builds.
Tempered Glass Side Panel: Features a glass left side panel for a premium aesthetic and component visibility.
Extensive Storage Capacity: Includes 2x 3.5-inch HDD bays and 5x 2.5-inch SSD bays for ample storage.
Flexible Cooling Options: Supports multiple 12cm/14cm fans and radiators up to 280mm on front and top.
Robust Steel Construction: Built with 0.6mm SPCC steel for durability and structural integrity.
Comprehensive Front I/O: Equipped with USB 3.0, two USB 2.0 ports, and HD Audio for connectivity.
OEM and ODM Services: Offers flexible customization from samples, designs, and full customization options.
High-Quality Manufacturing: Produced by a top 3 Chinese PSU manufacturer with 15 years of R&D experience.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard types are supported?
A:
This case supports E-ATX, ATX, M-ATX, and ITX motherboard types.
Q:Does the case come with a power supply?
A:
No, the power supply is not included and is optional.
Q:What are the cooling options available?
A:
It supports front 3x12cm or 3x140cm fans, top 2x12cm or 2x14cm fans, and radiators up to 280mm.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:Is customization available for this product?
A:
Yes, we offer full customization, minor customization, and flexible customization from samples or designs.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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