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Translucent Glass Side Panel RGB Light Matx Computer Case
US$15.10
500-999 Boxes
US$14.30
1,000-1,999 Boxes
US$13.20
2,000+ Boxes
Sample price:US$18.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
MicroATXPower Supply
Without Power SupplyCase Structure
ATXType
TowerMaterial
Steel plateColor
WhiteFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
200-300mmSheet Thickness
0.6mmFans Position
Front 12cm*2Pic Insert Slot
7Transport Package
CantonSpecification
340mm*200mm*385mmTrademark
SEGOTEPOrigin
ChinaProduction Capacity
1000000Key features
RGB Translucent Design: Features a translucent glass side panel with RGB lighting for aesthetic appeal.
OEM/ODM Customization: Supports full customization, minor customization, and flexible design options.
High-Quality Manufacturing: Produced by Segotep, a top 3 manufacturer with 15 years of experience and advanced testing.
Robust Steel Construction: Made from 0.6mm steel plate with a sturdy ATX tower structure.
Comprehensive Connectivity: Equipped with USB 3.0, USB 2.0, and HD Audio ports for easy device connection.
Certified Safety Standards: Products hold FCC and CE certifications ensuring global safety compliance.
Efficient Cable Management: Designed with back cable management to keep the interior tidy and organized.
Flexible Fan Configuration: Supports multiple fan positions including front, top, rear, and PSU cover mounts.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard sizes are supported?
A:
The case supports MicroATX and ITX motherboard specifications.
Q:Is the computer case customizable?
A:
Yes, we offer OEM and ODM services including full customization, minor customization, and flexible customization from samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 PCS.
Q:What certifications does the product have?
A:
The product has FCC and CE certifications.
Q:What are the lead times for production?
A:
Peak season lead time is one month, while off-season lead time is within 15 workdays.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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