Semi Welded Plate Heat Exchanger for High Temperature Gas Applications

Name: Semi Welded Plate Heat Exchanger for High Temperature Gas Applications
Brand: Shanghai Jiangxing Chemical Equipment Co., Ltd.
SKU: 2217563115

Shanghai, ChinaShanghai Jiangxing Chemical Equipment Co., Ltd.

US$500.00-2,000.00

1 Set

Sample price:US$500.00/set.Request sample

Product profile

Customization

Available

Warranty

10 Years

Certification

ISO, ISO 9001

Model NO.

Semi-Welded Plate Heat Exchanger

Application

Heater, Cooler, Vaporizer, Condenser

Principle

Recuperative Heat Exchanger

Style

Heat Exchange Unit

Material

304/316L/Ti/C276/Smo254/904L/Ni/Palladium

Delivery Time

10 Working Days

Material Type

SS304/SS316L

Max Temperaure

250temperaure

Design Pressure

3m/PA

Transport Package

Plywood Case

Specification

300kg-3T

Trademark

Shanghai Jiangxing

Origin

Shanghai, China

HS Code

8419500090

Production Capacity

80000 Set/Year

Company profile

Fast DeliveryQA/QC InspectorsR&D CapabilitiesManagement Certification

Shanghai Jiangxing Chemical Equipment Co., Ltd.

Shanghai, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 14 Years CertifiedNearest Port: Shanghai PortAverage Response Time: ≤2.26h

AI-Powered supplier vetting

SummarySHANGHAI JIANGXING CHEMICAL EQUIPMENT CO., LTD. is identified as a professional technical supplier offering 3D software design, ODM, OEM, and broad customization services. It has documented procedures for corrective actions, complaint handling, finished-product inspection, supplier assessment, and quality assurance. The supplier reports valid manufacturing contracts with related subcontractors and standardized lead times of within 15 working days in both peak and off-season periods. Export experience is stated as 14 years, with exports representing 51%–70% of total sales, although overseas service infrastructure is limited: no overseas agents or branches, warehouses, showrooms, or offline trade-show participation are reported. No certification information, financial performance details, or customer case references are provided. Innovation is supported by new-product development and ODM/OEM services, but no SDK is available. ERP, OA, CRM, and SAP system integration is absent or reported as zero.

Supplier typeThe supplier is explicitly described as a professional technical supplier providing 3D software design services. Its listed product is a non-electric fintube heat exchanger, model JXF-460-M, and its export history is stated as 14 years.

After-Sales capabilityThe supplier has documented and followed procedures for customer complaints and corrective/preventive actions, supporting a formal service-response process. However, it reports no overseas warehouse, showroom, agent or branch, and no overseas service countries, indicating limited overseas service infrastructure.

R&D capabilityThe supplier reports new-product development during the past year, ODM services, OEM services for well-known brands, and multiple levels of design customization. Conversely, it has no available SDK and no ERP, OA, CRM, or SAP integration, so the evidence supports product-development capability but not advanced digital innovation infrastructure.

Production capacityProduction and service operations are supported by valid contracts with related subcontractors, written inspection instructions that are uniformly followed, quality assurance, supplier-assessment procedures, and stated lead times within 15 working days year-round. The supplier reports no in-stock capacity, so production capability is evidenced but inventory readiness is limited.

Customization capabilityThe supplier explicitly offers customization from designs, full and minor customization, flexible customization, and customization from samples. Its 3D design, ODM, and OEM services further support the conclusion that it can handle multiple customization routes.