Custom BGA PCBA Assembly with Customized Copper Thickness for Communication Module PCB Board

Name: Custom BGA PCBA Assembly with Customized Copper Thickness for Communication Module PCB Board
Brand: Shanmute Electronic Equipment Co., Ltd.
SKU: 2166109062

Guangdong, ChinaShanmute Electronic Equipment Co., Ltd.

US$0.10-50.00

10 Pieces

Product profile

Customization

Available

Mode of Production

SMT

Layers

Multilayer

Base Material

Fr4, Aluminum, Rogers, Ceramic

Customized

Condition

New

Service

PCB/PCBA/PCB Assembly/Electronic Parts

Application

Electronics Device/Home Appliances

PCB Type

Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible P

Solder Mask Color

Green, White, Black, Blue, Red(Customized)

Board Thickness

0.2mm-8.0mm

Transport Package

ESD Bag, Carton Box

Specification

Customized

Trademark

Customized

Origin

China

HS Code

8534009000

Company profile

Low MOQCustomization from DesignsOEM ServicesFast Delivery

Shanmute Electronic Equipment Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2020-03-10Nearest Port: ShenzhenAverage Response Time: ≤0.58hTerms of Payment: T/T, PayPal, Western Union

AI-Powered supplier vetting

SummaryThe supplier is a combined company offering a broad range of design services with a robust R&D capability, including full and flexible customization options. They have a valid R&D audit documentation process, provide ODM services, and have experience with OEM for well-known brands. However, they lack overseas infrastructure such as warehouses and showrooms, and do not participate in offline trade shows or have overseas agents. Financial data suggests stability over the past three years, but there is no detailed information on certifications. Their quality control processes include quality assurance and traceability mechanisms, but they lack formal corrective and preventive action procedures.

Supplier typeThe supplier is identified as a combined company, indicating a multifaceted business structure.

Financial creditFinancial capacity data is available for the past three years, indicating consistent stability.

R&D capabilityStrong R&D capability with documented new product development and ODM services, though lacking SDK availability.

Customization capabilityOffers extensive customization options from samples to full customization, demonstrating flexibility.