High-Temperature Resistance: Operates reliably within a temperature range of -45 to 130 degrees Celsius.
Fast Hardening Speed: Cures in 3 to 15 seconds using UV light at 365nm-405nm wavelength.
Excellent Electrical Insulation: Features high dielectric strength of 25 kV/mm and mass resistivity of 7x10^14 ohm.cm.
Strong Adhesion: Provides strong bonding for FR4, PI, PC, FPC, and other electronic substrates.
Low Water Absorption: Water absorption rate is only 0.8% at 25 degrees Celsius.
OEM/ODM Service: Flexible customization available with market protection for partners.
High Shear Strength: Shear strength reaches 2.9 MPa and maintains 4.0 MPa after 1000 hours of thermal shock.
Multiple Viscosity Options: Available in low viscosity (4500-6500 mPa.s) and medium viscosity (10000-14000 mPa.s).