High Thermal Conductivity: Features 1.0 W/mK thermal conductivity for efficient heat dissipation in electronic components.
Superior Adhesion: Provides strong bonding with anti-cracking properties for automotive and machinery applications.
Low CTE Stability: Low linear thermal expansion coefficient ensures stability and prevents damage during temperature changes.
Customizable Formulation: Flexible customization available for weight ratio, hardness, viscosity, and potting life to meet specific needs.
Multi-Color Options: Available in Black, White, Red, and Transparent colors to suit different visual requirements.
RoHS Compliant Material: Solventless organic material composition ensuring environmental safety and low water absorption.