Fast Room Temperature Curing: Cures without heat in 5-120 minutes after mixing parts A and B at 1:1 ratio.
Broad Material Compatibility: Effectively bonds ceramic, metal, glass, plastic, rubber, paper, and cloth.
Wide Temperature Resistance: Operates stably within a temperature range of -50 to 180 degrees Celsius.
Excellent Dielectric Strength: Provides high insulation with dielectric strength greater than 20 Kv/mm.
Solvent-Free Formulation: No solvents or curing byproducts, ensuring stable mechanical and electrical properties.
OEM and ODM Services: Customization options available with protection for customer market rights.
ISO Certified Quality: Manufactured under ISO 9001 and ISO 14001 certified management systems.