Fast Room Temperature Curing: Cures without heat in 5-120 minutes after mixing parts A and B at 1:1 ratio.
Wide Temperature Resistance: Maintains stable mechanical and electrical properties between -45 and 120 degrees Celsius.
High Strength Adhesion: Excellent bonding strength for ceramic, metal, glass, plastic, rubber, paper, and cloth.
Solvent-Free Formula: No solvents or curing byproducts, ensuring clean and stable performance.
Excellent Dielectric Properties: Dielectric strength exceeds 20 kV/m with low loss factor and high volume resistance.
Flexible Customization: Offers flexible customization options for specific application requirements.
Multiple Packaging Options: Available in 50ml cartridges, 400ml cartridges, and 1kg or 20kg drums.
ISO Certified Quality: Manufactured under ISO 9001 and ISO 14001 certified management systems.