Fast Curing at Room Temperature: Cures without heat in 5-120 minutes after mixing parts A and B.
High Adhesion on Glass: Designed for strong bonding on properly prepared glass surfaces.
Versatile Material Bonding: Bonds ceramic, metal, glass, plastic, rubber, paper, and cloth.
Wide Temperature Resistance: Stable mechanical and electrical properties between -45 and 120 degrees Celsius.
Solvent-Free Formula: No solvents and no curing byproducts for clean application.
Excellent Dielectric Strength: Dielectric strength exceeds 20 kV/m at 25 degrees Celsius.
Flame Retardant Certification: Meets UL 94 V-0 standard for flame retardancy.
Flexible Customization Options: Offers flexible customization for specific application needs.