ESD Antistatic Plastic Packing Bag for IC, PCB with Hic and Desicccant

Name: ESD Antistatic Plastic Packing Bag for IC, PCB with Hic and Desicccant
Brand: Shenzhen Xunlan Technology Co., Ltd.
SKU: 2034888222

Guangdong, ChinaShenzhen Xunlan Technology Co., Ltd.

US$0.088-0.99

5,000 Pieces

Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

Industrial Use

Apparel, Anti Static Bag Packaging for Electronics

Transparency

Translucent

Model NO.

1-0505

Layered

APET+CPP or APET+PE

Hardness

Rigid

Basic Level

APET

Heat Seal

CPP or PE

Functional Layer

APET+CPP or APET+PE

Packaging

Bag

Bag Sealing Methods

Ziplock / Customized

Seams

2 or 3 Sealing Sides

Anti-Static Value

10^6-10^11 Omega

Inner Layer Resistance

10^6-10^11 Omega

Conventional Thickness

0.075~0.2 mm

Water Vapor Transmission Rate (Wvtr)

Less Than or Equal to 0.31 G /M 2.24 H

Test Method

ASTM F1249-13, ASTM D3985-2005(2010)E1

Surface Resistance

10^6-10^11 Omega

Design

Transport Package

Cartons

Specification

Customized Size

Trademark

Xunlan

Origin

China

HS Code

3923290000

Production Capacity

100000PCS/Day

Company profile

Shenzhen Xunlan Technology Co., Ltd.

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2010-04-10Nearest Port: Shenzhen nanshan shekou port., Shenzhen yantian shekou port.Average Response Time: ≤2.55hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CIF, CIP

About Our Factory & Business Background

Address2nd Floor, Building 1, Fuzhen Industrial Park, Yutang Street, Guangming District, Shenzhenguangdong P. R. China 518105, Shenzhen, Guangdong, China

Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsBubble Malier, Corrugated Padded Envelope, Padded Shipping Envelope, Honeycomb Paper Envelope, ESD Bag, Aluminum Foil Bags, Thermal & Insulation, Carton Box, Vacuum Pouch Bag, Conductive Bag